US 2026/0253786 A1 · COIL BOARD AND MANUFACTURING METHOD THEREOF

Abstract

A coil board includes a first coil, a first plating layer covered on the first coil, a dielectric layer covered on the first plating layer, a second coil on the dielectric layer and a second plating layer covered on the second coil. The first plating layer is located between the dielectric layer and the first coil, the dielectric layer includes a first blind hole, and the second coil is conductively connected to the first coil via the first blind hole. The coil board further includes a first conductive pad disposed in parallel with the first coil and a second conductive pad disposed in parallel with the second coil. The dielectric layer includes a second blind hole, and the second conductive pad is conductively connected to the first conductive pad via the second blind hole.

Claims12

Dependent claims

A coil board comprising:

a first coil;
a first plating layer covered on the first coil;
a dielectric layer covered on the first plating layer;
a second coil on the dielectric layer;
a second plating layer covered on the second coil;
a first conductive pad disposed in parallel with the first coil;
and
a second conductive pad disposed in parallel with the second coil,
wherein the first plating layer is located between the dielectric layer and the first coil,
the second coil is conductively connected to the first coil via the first blind hole,
the dielectric layer includes a first blind hole and a second blind hole, and
the second conductive pad is conductively connected to the first conductive pad via the second blind hole.

9 more elements

A method for manufacturing a coil board, the method comprising:

(a) preparing a bearing board;
(b) forming a first coil and a first conductive pad on the bearing board;
(c) electroplating on an entire surface to form a first plating layer covered on the first coil and the first conductive pad;
(d) pressing a dielectric layer on the first plating layer and providing a first blind hole and a second blind hole;
wherein the first blind hole exposes the first plating layer provided on the first coil;
and the second blind hole exposes the first plating layer provided on the first conductive pad;
(e) forming a second coil and a second conductive pad on the dielectric layer, wherein the second coil is conductively connected to the first coil via the first blind hole, and the second conductive pad is conductively connected to the first conductive pad via the second blind hole;
(f) electroplating a second plating layer on the second coil and the second conductive pad, wherein the first conductive pad and the second conductive pad are located in a non-product area;
and
(g) removing the bearing board.

7 more elements

Dependencies are inferred from the claim text.

Coil board and manufacturing method thereof

Life of this patent

Coil board and manufacturing method thereof

Life of this patent

Abstract

Claims12