Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for manufacturing multilayer printed wiring board

Abstract

Provided is a photosensitive resin composition containing (X) an inorganic filler that is solid particles having a true density of 1,500 kg/m3 or less. Also provided is a photosensitive resin film formed by using the photosensitive resin composition. Further provided is a multilayered printed wiring board containing an interlayer insulating layer that is formed by using the photosensitive resin composition or the photosensitive resin film and a method for producing the multilayered printed wiring board. Furthermore provided is a semiconductor package including the multilayered printed wiring board and a semiconductor element.

Dependencies are inferred from the claim text.