Back to results
US 2026/0251971 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing circuit board
OwnerAkane ONO, Keishi ONO +4inventors
InventorsAkane ONO, Keishi ONO, Mao NARITA, Shiho TANAKA, Akiko TAKEDA, Yusuke SAKASHITA
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the photopolymerization initiator contains a hexaarylbiimidazole compound and an N-phenylglycine compound, and the sensitizer contains an anthracene compound.
Claims11
A photosensitive resin composition comprising:
- a binder polymer;
- a photopolymerizable compound;
- a photopolymerization initiator, and a sensitizer, wherein
- the photopolymerization initiator contains a hexaarylbiimidazole compound and an N-phenylglycine compound, and
- the sensitizer contains an anthracene compound.
2 more elements
Dependencies are inferred from the claim text.