Photonic fabric chip device
AssigneePanduit Corp.
InventorsJose M. Castro, Richard J. Pimpinella, Bulent Kose, Yu Huang, Ronald A. Nordin, Robert A. Reid
Life of this patent
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Abstract
Apparatuses having a plurality of optical duplex and parallel connector adapters, such as MPO connectors and LC adapters, where some adapters connect to network equipment in a network and others to servers or processing units such as GPUs, incorporate internal photonic circuit with a mesh. The light path of each transmitter and receivers is matched in order to provide proper optical connections from transmitting to receiving fibers, wherein complex arbitrary network topologies can be implemented.
Claims4
An assembly comprising:
- an internal photonic circuit chip with an interconnection mesh, the chip having eight front parallel ports and eight rear parallel ports,
- wherein the interconnection mesh matches the light path between respective transmitter adapters and receiver adapters in a network topology to provide optical connections from transmitting to receiving fibers, wherein the internal photonic circuit is supported and protected by the assembly;
- a first array of first fiber groups connected to the front parallel ports and a second array of second fiber groups connected to the rear parallel ports, wherein the first and second fiber groups separate respectively from the first and second arrays of fiber groups,
- wherein each fiber group of the first fiber groups is connected, using fusion or mechanical splices or connectors, to a respective one of third fiber groups which are terminated in a respective connector adapter of a first plurality of duplex or parallel fiber connector adapters,
- wherein each fiber group of the second fiber groups is connected, using fusion or mechanical splices or connectors, to a respective one of fourth fiber groups which are terminated in a respective connector adapter of a second plurality of duplex or parallel fiber connector adapters,
- wherein one or more of the adapters are connectable to at least one of network equipment in a network, to servers, or processing units.
An assembly according to any preceding claim,
- wherein waveguides of the internal photonic circuit chip are written at different layers inside glass and maintain at least a minimum separation, optionally of at least 40 μm, along their trajectories,
- wherein one or more waveguides of the internal photonic circuit chip connect transmitting and receiving ports of an optical channel according to a mesh interconnection map.
An assembly according to any preceding claim, wherein waveguides have circular cross-section shapes, with refractive index contrast in the range of 0.2% to 2%.
Dependencies are inferred from the claim text.