Stabilized hot melt pressure-sensitive adhesives

Abstract

High-performance, hot melt pressure-sensitive adhesives (“hmPSAs”) including 40 weight percent (“wt. %”) to 60 wt. % of a block copolymer comprising polystyrene and polyisoprene, 30 wt. % to 60 wt. % of a first tackifying resin, 1 wt. % to 15 wt. % of a polyphenylene oxide tackifier; and 0.5 wt. % to 5 wt. % of a stabilizer represented by the Structure I: (I) where each of R1, R2, R3, and R4 is independently selected from the group consisting of a C1 to C5 alkyl group, an unsubstituted phenyl group, a substituted phenyl group, an unsubstituted benzyl group, a substituted benzyl group, and combinations thereof. Articles comprising the hmPSAs and methods of preparing the hmPSAs are provided.

Dependencies are inferred from the claim text.