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US 2026/0250550 A1Published application
Slurry and polishing method
OwnerMasanori MAEDA, Junya SAKAGUCHI +3inventors
InventorsMasanori MAEDA, Junya SAKAGUCHI, Shigeki KUBOTA, Sota TAINAKA, Makoto MIZUTANI
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Abstract
A slurry contains abrasive grains and water, in which the abrasive grains include cerium oxide particles, and a product P of a ratio R of a peak intensity of a (200) plane to a peak intensity of a (111) plane in an X-ray diffraction measurement of the cerium oxide particles and a crystallite diameter D of the (111) plane of the cerium oxide particles is 7.5 to 11.0 nm. A polishing method includes a step of polishing a surface to be polished using the slurry.
Claims9
A slurry comprising abrasive grains and water,
- wherein the abrasive grains comprise cerium oxide particles, and
- a product P of a ratio R of a peak intensity of a (200) plane to a peak intensity of a (111) plane of the cerium oxide particles in an X-ray diffraction measurement and a crystallite diameter D of the (111) plane of the cerium oxide particles is 7.5 to 11.0 nm.
Dependencies are inferred from the claim text.