Abrasive grains and selection method therefor, polishing fluid, multi-component polishing fluid, polishing method, component manufacturing method, and semiconductor component manufacturing method

Abstract

A selection method for abrasive grains, in which the abrasive grains contain cerium, and the abrasive grains are selected on the basis of a crystallite diameter. Abrasive grains containing cerium, in which a crystallite diameter is 30 nm or more. A polishing liquid containing the above-described abrasive grains and water. A multi-pack polishing liquid having a first liquid containing the above-described abrasive grains and water, and a second liquid containing a component other than the above-described abrasive grains and water, and water. A polishing method including polishing a member to be polished by using the above-described polishing liquid.

Dependencies are inferred from the claim text.