Polyamideimide and polyamideimide film
AssigneeResonac Corporation
InventorsSaori MIURA, Atsushi TAKAHASHI
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Abstract
An embodiment relates to a polyamideimide, including: a structure derived from a compound including at least one selected from the group consisting of a diamine and a diisocyanate, and a structure derived from a carboxylic acid compound including at least a tricarboxylic anhydride, wherein at least one selected from the compound and the carboxylic acid compound includes a compound having a group that includes at least one non-aromatic hydrocarbon group, where a total number of carbon atoms in the at least one non-aromatic hydrocarbon group is eight or more, and at least one selected from the compound and the carboxylic acid compound includes a compound having an aromatic hydrocarbon group.
Claims16
A polyamideimide, comprising:
- a structure derived from a compound including at least one selected from the group consisting of a diamine and a diisocyanate, and a structure derived from a carboxylic acid compound including at least a tricarboxylic anhydride, wherein
- at least one selected from the compound and the carboxylic acid compound includes a compound having a group that includes at least one non-aromatic hydrocarbon group, where a total number of carbon atoms in the at least one non-aromatic hydrocarbon group is eight or more, and
- at least one selected from the compound and the carboxylic acid compound includes a compound having an aromatic hydrocarbon group.
Dependencies are inferred from the claim text.