Cutting device and method for applying cut tracks in an outer packaging
AssigneeTGW Logistics GmbH
InventorsStefan HOLZNER, Thomas SCHLOSSER, Franziska Hildegard SCHNEIDER, Michael Kurt ZERWER
Life of this patent
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Abstract
The disclosure relates to a cutting device and a method for applying substantially circumferential cutting paths in an outer packaging in order to cut off a collar and/or a window cutout. The cutting device comprises a first cutting module, which comprises two opposite cutting units, each being movable along a first cutting direction. In addition, the cutting device comprises a control unit for determining a cutting height and for actuating the cutting units, a positioning device for positioning the outer packaging, and a conveying device.
Claims67
A cutting device for applying a substantially circumferential cutting path in an outer packaging filled with goods up to a filling level, the cutting path comprises a first cutting path, a second cutting path, a third cutting path and a fourth cutting path such that the first, second, third and fourth cutting path adjoin one another and form the circumferential cutting path for cutting off a collar and/or window cutout, the cutting device comprises:
- a first cutting module having two opposite cutting systems, each with a cutting unit,
- wherein the cutting units are movable parallel to a first cutting direction such that cutting paths of the cutting paths, respectively running parallel to one another in pairs, can be applied, and
- wherein the cutting units each have a cutting head and a cutting element mounted on the cutting head,
- a control unit configured to determine a cutting height to actuate the cutting units such that the circumferential cutting path is applied at the cutting height, and
- a positioning device configured to position the outer packaging for applying the first and second cutting path in a first cutting position and for applying the third and fourth cutting path in a second cutting position.
A cutting device for applying a substantially circumferential cutting path in side walls in an outer packaging filled with goods up to a filling level, wherein the cutting device:
- is configured to apply a first cutting path in a first side wall of the side walls and a second cutting path in a second side wall of the side walls and a third cutting path in a third side wall of the side walls and a fourth cutting path in a fourth side wall of the side walls, such that the first, second, third and fourth cutting path adjoin one another and form the circumferential cutting path for cutting off a collar,
- and a first cutting module, which comprises two opposite cutting systems, each with a cutting unit, wherein the cutting units are movable parallel to a first cutting direction such that a cutting path of the cutting paths can respectively be applied in the opposite side walls of the outer packaging, and
- wherein the cutting units each have a cutting head and a cutting element mounted on the cutting head,
- wherein the cutting device further has
- a control unit for determining a cutting height, which is configured to actuate the cutting units such that the circumferential cutting path is applied at the cutting height, and
- a positioning device, which is configured to position the outer packaging for applying the first and second cutting path in a first cutting position and for applying the third and fourth cutting path in a second cutting position.
A method for applying a circumferential cutting path in side walls of an outer packaging filled with goods up to a filling level by a cutting device, in particular by a cutting device, comprising the steps:
- i) providing the outer packaging at the cutting device,
- ii) determining a cutting height, at which the circumferential cutting path is to be applied to the outer packaging by a control unit,
- iii) moving the outer packaging to a first cutting position by a conveying device and positioning the outer packaging in the first cutting position by a positioning device,
- iv) actuating opposite cutting systems to apply a first cutting path pair, which comprises a first and a second cutting path, by the control unit, wherein the opposite cutting systems each comprise a cutting unit, each having a cutting element, and wherein the cutting elements are aligned at the determined cutting height,
- v) applying, parallel to a cutting direction for applying the first cutting path pair,
- the first cutting path in a first side wall of the outer packaging by the cutting element aligned at the determined cutting height of step iv), the cutting element being of a first cutting system of the opposite cutting systems for applying the first cutting path pair, and
- the second cutting path in a second side wall of the outer packaging by the cutting element aligned at the determined cutting height of step iv), the cutting element being of a second cutting system of the opposite cutting systems for applying the first cutting path pair,
- vi) moving the outer packaging from the first cutting position to a second cutting position, in particular by the conveying device, and positioning the outer packaging in the second cutting position by the positioning device,
- vii) actuating opposite cutting systems to apply a second cutting path pair, which comprises a third and a fourth cutting path, by the control unit, wherein the opposite cutting systems each comprise a cutting unit, each having a cutting element, and wherein the cutting elements are aligned at the determined cutting height,
- viii) applying, parallel to a cutting direction for applying the second cutting path pair,
- the third cutting path in a third side wall of the outer packaging by the cutting element aligned at the determined cutting height of step vii), the cutting element being of a first cutting system of the opposite cutting systems for applying the second cutting path pair, and
- the fourth cutting path in a fourth side wall of the outer packaging by the cutting element aligned at the determined cutting height of step vii), the cutting element being of a second cutting system of the opposite cutting systems for applying the second cutting path pair,
- such that the first, second, third and fourth cutting path result in a substantially horizontally circumferential cutting path, thereby cutting off a collar of the outer packaging,
- ix) lifting the cut-off collar of the outer packaging, and
- x) transporting the outer packaging from the second cutting position after lifting the collar according to step ix) by the conveying device.
Dependencies are inferred from the claim text.