Electronic component and equipment including electronic component
AssigneeCanon Kabushiki Kaisha
InventorYU KATASE
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Abstract
An electronic component comprises a semiconductor substrate; a base; a cooling component, and a plate member including a wiring. The plate member is arranged between a cold side of the cooling component and the semiconductor substrate, the base is arranged on a hot side of the cooling component, a first electrode is arranged on the semiconductor substrate, a second electrode and a third electrode are arranged on the plate member, and a fourth electrode is arranged on the base, the second electrode and the third electrode are connected by the wiring of the plate member, the first electrode and the second electrode are connected by a first bonding wire, and the third electrode and the fourth electrode are connected by a second bonding wire.
Claims20
An electronic component comprising:
- a semiconductor substrate;
- a base;
- a cooling component, and a plate member including a wiring,
- wherein the plate member is arranged between a cold side of the cooling component and the semiconductor substrate,
- the base is arranged on a hot side of the cooling component,
- a first electrode is arranged on the semiconductor substrate, a second electrode and a third electrode are arranged on the plate member, and a fourth electrode is arranged on the base,
- the second electrode and the third electrode are connected by the wiring of the plate member, the first electrode and the second electrode are connected by a first bonding wire, and the third electrode and the fourth electrode are connected by a second bonding wire, and
- at least a part of the wiring of the plate member overlaps a region in which the cooling component is arranged in a planar view.
Dependencies are inferred from the claim text.