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US 2026/0247978 A1Published application
Semiconductor device
AssigneeWinbond Electronics Corp.
InventorsJin-Neng Wu, Shuo-Che Chang
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes multiple semiconductor dies and a die-to-die interconnect. The semiconductor dies are located on both sides of a predetermined scribe-line area. The die-to-die interconnect electrically connects the semiconductor dies, in which in a top view, the die-to-die interconnect includes multiple crack-prevention corners located in the predetermined scribe-line area.
Claims17
A semiconductor device, comprising:
- a plurality of semiconductor dies located on both sides of a predetermined scribe-line area;
- and
- a die-to-die interconnect electrically connecting the semiconductor dies, wherein in a top view, the die-to-die interconnect comprises a plurality of crack-prevention corners located in the predetermined scribe-line area.
Dependencies are inferred from the claim text.