System for fixing semiconductor wafer to electrostatic chuck and method for fixing semiconductor wafer to electrostatic chuck using same

Abstract

A system for fixing a semiconductor wafer to an electrostatic chuck according to an embodiment of the present disclosure includes an electrostatic chuck, a semiconductor adhesive film including a base layer, a conductive layer formed on the base layer, and an adhesive layer formed on the conductive layer, in which the semiconductor adhesive film is fixed to the electrostatic chuck so that the base layer faces the electrostatic chuck, and a semiconductor wafer adhering to the adhesive layer. According to the present disclosure, the system for fixing the semiconductor wafer to the electrostatic chuck and the method for fixing the semiconductor wafer to the electrostatic chuck enable the semiconductor wafer to be stably fixed to and separated from the electrostatic chuck by adhering the semiconductor adhesive film to the semiconductor wafer.

Dependencies are inferred from the claim text.