Heat-flow controlled phase change material device with sidewall liners and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Ju LI, Kuo-Pin CHANG, Chang-Chih HUANG, Yu-Wei TING, Chih-Ren HSIEH, Kuo-Ching HUANG, Harry-Hak-Lay CHUANG
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