Light-emitting photosensitive sensor structure and manufacturing method thereof

Abstract

A light-emitting photosensitive sensor structure includes a package substrate having a cavity, on a bottom of which a first line layer is formed, enclosed by a light-shield frame provided thereon with a light transmission channel leading to outside, a light-emitting photosensitive sensor mounted in the cavity and electrically connected to the first line layer, and a transparent packaging layer filled in the cavity and the light transmission channel, and a light-shield layer provided on the transparent packaging layer such that the light-emitting photosensitive sensor structure has a selective light-emitting and light-receiving direction along the light transmission channel.

Dependencies are inferred from the claim text.