Lens structure configured to increase quantum efficiency of image sensor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiech-Fun Lu, Chun-Tsung Kuo
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Abstract
Various embodiments of the present disclosure are directed towards an integrated chip. A substrate comprises a plurality of protrusions on a first surface of the substrate. A plurality of photosensitive regions are in the substrate under the plurality of protrusions. A first plurality of lens structures are on the first surface of the substrate. A first lens structure of the first plurality of lens structures is laterally between a pair of adjacent protrusions of the plurality of protrusions. A height of the first lens structure is greater than a height of the plurality of protrusions.
Claims20
An integrated chip, comprising:
- a substrate comprising a plurality of protrusions on a first surface of the substrate;
- a plurality of photosensitive regions in the substrate and underlying the plurality of protrusions;
- and
- a first plurality of lens structures on the first surface of the substrate, wherein a first lens structure of the first plurality of lens structures is laterally between a pair of adjacent protrusions of the plurality of protrusions, wherein a height of the first lens structure is greater than a height of the plurality of protrusions.
An integrated chip, comprising:
- a substrate comprising a plurality of protrusions on a first surface of the substrate;
- a plurality of photosensitive regions in the substrate and underlying the plurality of protrusions;
- and
- a plurality of lens structures on the first surface of the substrate, wherein the plurality of lens structures are laterally interleaved with the plurality of protrusions, wherein a first lens structure of the plurality of lens structures has a first segment extending below a top of a first protrusion of the plurality of protrusions and a second segment over the first segment, wherein a first shape of the first segment is different from a second shape of the second segment in a cross-sectional view.
An integrated chip, comprising:
- a substrate comprising a plurality of protrusions on a first surface of the substrate;
- a plurality of photosensitive regions in the substrate and underlying the plurality of protrusions;
- and
- a plurality of lens structures on the plurality of protrusions, wherein a first lens structure of the plurality of lens structures is configured to direct electromagnetic radiation towards a first point underlying an upper surface of the first lens structure, wherein the first point is spaced laterally between a pair of protrusions of the plurality of protrusions and is arranged bellow a top of the plurality of protrusions.
Dependencies are inferred from the claim text.