Semiconductor device
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorsHiroki MIYAKE, Hirofumi KIDA
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AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorsHiroki MIYAKE, Hirofumi KIDA
Estimating the term…
A semiconductor device includes a collector layer, a base layer disposed above the collector layer, an emitter layer disposed above the base layer and having a width narrower than a width of the base layer, a collector electrode electrically connected to the collector layer, an emitter electrode electrically connected to the emitter layer, a base electrode electrically connected to the base layer, and a surface recombination prevention layer disposed between the emitter layer and the base layer, and having a structure different from the base layer and emitter layer. The surface recombination prevention layer is disposed so as to cover, on one surface of the base layer that faces the emitter layer, a region located between an emitter-layer facing portion that faces the emitter layer and a base-electrode facing portion that faces the base electrode.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.