Semiconductor device
AssigneeMicron Technology, Inc.
InventorKazuyuki Morishige
Life of this patent
Estimating the term…
Abstract
An apparatus includes: a first wiring in one of lower and upper wiring layers; a second wiring in the other of the lower and upper wiring layers, the second wiring extending in parallel to the first wiring; a plurality of contact plugs coupled between the first wiring and the second wiring and arranged in line along the first wiring and the second wiring; and a third wiring in the one of the lower and upper wiring layers, the third wiring being branched into a plurality of wiring segments which are directly coupled to the first wiring.
Claims20
An apparatus comprising:
- a first wiring in one of lower and upper wiring layers;
- a second wiring in the other of the lower and upper wiring layers, the second wiring extending in parallel to the first wiring;
- a plurality of contact plugs coupled between the first wiring and the second wiring and arranged in line along the first wiring and the second wiring;
- and
- a third wiring in the one of the lower and upper wiring layers, the third wiring being branched into a plurality of wiring segments which are directly coupled to the first wiring.
An apparatus comprising:
- a first wiring in a lower wiring layer;
- a second wiring in an upper wiring layer, extending in parallel to the first wiring;
- a plurality of contact plugs coupled between the first wiring and the second wiring and arranged in line along the first wiring and the second wiring;
- and
- a third wiring in the lower wiring layer, being branched into a plurality of wiring segments which are directly coupled to the first wiring.
An apparatus comprising:
- a first wiring in a first wiring layer;
- a second wiring in a second wiring layer arranged above or below the first wiring layer and extending in parallel to the first wiring;
- a plurality of groups, each of the groups having a plurality of contact plugs coupled between the first wiring and the second wiring and arranged in line along the first wiring and the second wiring;
- and
- a third wiring in the first wiring layer, being branched into a plurality of wiring segments;
- wherein each wiring segment is directly coupled to a portion of the first wiring corresponding to one of the groups associated with each of the wiring segments.
Dependencies are inferred from the claim text.