Substrate processing apparatus, temperature control device, and temperature control method
AssigneeTokyo Electron Limited
InventorTakuya HARASHIMA
Life of this patent
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Abstract
A plasma processing system has a supply, a main body section, and controller circuitry. The supply supplying each of a plurality of heat media, the plurality of heat media having a different temperature. The main body section has, formed therein, a plurality of flow paths that respectively allow the plurality of heat media to separately flow therethrough, and is included in the plasma processing system. The controller circuitry performs control, when a first heat medium of the plurality of heat media is caused to flow through the plurality of flow paths from the supply, to cause a second heat medium of the plurality of heat media and other than the first heat medium to be discharged from the plurality of flow paths.
Claims20
A substrate processing apparatus, comprising:
- a heat medium supply supplying each of a plurality of heat media, the plurality of heat media having different temperatures from one another;
- a component included in the substrate processing apparatus and having a plurality of flow paths formed in the component, the plurality of flow paths respectively allowing the plurality of heat media to separately flow through the plurality of flow paths;
- and
- controller circuitry configured to, when a first heat medium of the plurality of heat media is caused to flow to the plurality of flow paths from the heat medium supply, cause a second heat medium of the plurality of heat media and other than the first heat medium to be discharged from the plurality of flow paths.
A temperature control device, comprising:
- a heat medium supply supplying each of a plurality of heat media, the plurality of heat media having different temperatures from one another;
- and
- controller circuitry configured to perform control, when a first heat medium of the plurality of heat media is caused to flow from the heat medium supply to a plurality of flow paths that are formed in a target member to be subjected to temperature control, are individually connected to the heat medium supply, and respectively allow the plurality of heat media to separately flow therethrough, a second heat medium of the plurality of heat media and other than the first heat medium is discharged from the plurality of flow paths.
A temperature control method, including:
- a process of causing a first heat medium of a plurality of heat media, the plurality of heat media different temperatures from one another, to flow from a heat medium supply supplying each of the plurality of heat media, to a plurality of flow paths formed in a component included in a substrate processing apparatus, the plurality of flow paths being individually connected to the heat medium supply and respectively allowing the plurality of heat media to separately flow therethrough;
- and
- a process of causing, when the first heat medium is caused to flow to the plurality of flow paths, a second heat medium of the plurality of heat media and other than the first heat medium to be discharged from the plurality of flow paths.
Dependencies are inferred from the claim text.