Surface plasmon lithography method

A surface plasmon lithography method, comprising:

• determining, based on a target imaging pattern, an inner radius and an arrangement mode of a target pattern, wherein the target pattern is a periodically-arranged circular pattern formed by projection of a mask absorption layer on a surface of a substrate in a multilayer metasurface superlens;
• using a TM (Transverse Magnetic)-polarized light with a wavelength of 365 nm as an incident light;
• and
• vertically irradiating the incident light on a substrate with the target pattern of a target multilayer metasurface superlens to form the target imaging pattern on a mask layer of a to-be-lithographed structure, wherein the multilayer metasurface superlens comprises the substrate, the mask absorption layer, a filling layer, a first metal-dielectric composite film and a second metal-dielectric composite film stacked sequentially, the to-be-lithographed structure comprises a wafer, a metal reflecting layer and the mask layer stacked sequentially, and the mask layer is arranged close to the second metal-dielectric composite film in the target multilayer metasurface superlens.