Back to results
US 2026/0244100 A1Published application
Photosensitive element, and method for forming resist pattern
OwnerNaoki HIRAMATSUinventor
Life of this patent
Estimating the term…
Abstract
A photosensitive element, including: a support; and a photosensitive layer on the support by using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a coumarin-based sensitizer, in which a thickness of the photosensitive layer is 30 μm or more.
Claims21
A photosensitive element, comprising:
- a support;
- and
- a photosensitive layer formed on the support by using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a coumarin-based sensitizer,
- wherein a thickness of the photosensitive layer is 30 μm or more.
1 more element
Dependencies are inferred from the claim text.