Wiring Substrate and Method for Manufacturing the Same, Light-Emitting Substrate and Display Apparatus

A method for manufacturing a wiring substrate, comprising:

• providing a motherboard substrate, the motherboard substrate having a first surface and having a plurality of substrate unit regions;
• forming a plurality of pad units, a plurality of first connection lines and a plurality of dummy conductive patterns synchronously in a substrate unit region using a same patterning process to form a wiring substrate motherboard, wherein the pad units each include a plurality of device pad groups, a first connection line includes a plurality of connection sub-segments, and two adjacent device pad groups in a same pad unit are connected by a connection sub-segment;
• a dummy conductive pattern is located on at least one side of the connection sub-segment, and an extension direction of the dummy conductive pattern is parallel to an extension direction of the connection sub-segment adjacent to the dummy conductive pattern;
• and
• cutting the wiring substrate motherboard to form the wiring substrate.