Semiconductor device

Abstract

The present disclosure relates to a semiconductor device that makes it possible to implement DUT measurement of a semiconductor device that is mounted even on a chip-stacked wafer of a CoW structure. Logic chips each including a singulated signal processing circuit, a singulated memory circuit, or the like are stacked on a wafer on which a plurality of imaging elements have been formed, a terminal is formed on the surface of a scribe that is a portion to be cut at a time of singulation, a connection wiring that connects the terminal on the surface of the scribe and a DUT of the Logic chip is formed between the wafer and the Logic substrate, and the terminal is connected with a probe to implement the DUT measurement without singulation. The present disclosure is applicable to a semiconductor device.

Dependencies are inferred from the claim text.