Measurement sensor for a thermal measurement variable and measurement station comprising such a measurement sensor

A measurement sensor for determining a thermal measurement variable of a medium in a container by contacting the container, comprising a coupling element;

• and
• a sensor module;
• wherein the coupling element comprises:
• a main body with a contact surface for contacting the container,
• wherein the coupling element has a sensor chamber, which is cylindrical at least in sections, for receiving a sensor element for determining and/or monitoring the process variable,
• wherein the sensor chamber is arranged at least in sections in the main body,
• wherein a longitudinal axis of the sensor chamber is at a distance of not more than four radii of the sensor chamber from the contact surface, wherein
• the contact surface has multiple normal vectors, the intersection points of which define a guide curve, wherein a minimum distance vector is given between the guide curve and the longitudinal axis of the bore, wherein the distance vector and a direction vector of the guide curve at the intersection point of the guide curve with the distance vector span a reference plane, to which the longitudinal axis of the bore has an angle of not less than 25°;
• wherein the sensor module comprises:
• at least one sensor element for detecting a temperature;
• at least one module base body;
• and
• at least one thermal bridge body;
• wherein the sensor element is arranged in a first end portion of the sensor chamber,
• wherein the module base body is arranged at a second end portion of the sensor chamber that faces away from the first end portion,
• wherein the thermal bridge body extends in the sensor chamber at least over a portion that extends between the sensor element and the module base body,
• wherein, along the longitudinal axis of the sensor chamber, cross-sections of the sensor chamber are larger than the respective coplanar cross-sections of the thermal bridge bodies,
• wherein the thermal bridge body is firmly bonded to the module base body, and
• wherein the module base body is firmly bonded to the wall of the sensor chamber in an end portion of the sensor chamber that faces away from the sensor element.