Rivet for use in semiconductor module arrangement, method for producing a rivet, and method for connecting rivet to a substrate
AssigneeInfineon Technologies AG
InventorsLukas Meis, Daniel Pielsticker, Guido Strotmann, Florian Dreps
Life of this patent
Estimating the term…
Abstract
A method for connecting a rivet to a substrate of a semiconductor module arrangement includes providing a chain of rivets to a joining tool, moving the joining tool to a defined position on the substrate, separating a rivet forming an end of the chain of rivets from the chain of rivets, and connecting the separated rivet to the substrate by means of the joining tool.
Claims15
A method for producing a rivet for a semiconductor module arrangement, comprising:
- arranging a meal sheet in a stamping tool, wherein the metal sheet has a length in a first direction that is significantly larger than a height of the metal sheet in a second direction perpendicular to the first direction;
- and
- performing a stamping process by means of the stamping tool, thereby forming a chain of successive rivets, each rivet of the plurality of rivets comprising a tubular part and a collar formed at one end of the tubular part, and a plurality of coupling joints, wherein each coupling joint of the plurality of coupling joints connects two directly successive rivets to each other, and wherein each coupling joint of the plurality of coupling joints forms a predetermined breaking point, or each coupling joint of the plurality of coupling joints is configured to be cut through by means of a cutting tool.
A chain of rivets for a semiconductor module arrangement, comprising:
- a plurality of successive rivets, each rivet of the plurality of rivets comprising a tubular part and a collar formed at one end of the tubular part;
- and
- a plurality of coupling joints, wherein
- each coupling joint of the plurality of coupling joints connects two directly successive rivets to each other,
- each coupling joint of the plurality of coupling joints forms a predetermined breaking point, or each coupling joint of the plurality of coupling joints is configured to be cut through by means of a cutting tool, and
- the plurality of rivets and the plurality of coupling joints are integrally formed in one piece.
A method for connecting a rivet to a substrate of a semiconductor module arrangement, comprising:
- providing a chain of rivets, the chain of rivets comprising:
- a plurality of successive rivets (44), each rivet (44) of the plurality of rivets (44) comprising a tubular part (442) and a collar (444) formed at one end of the tubular part (442);
- and
- a plurality of coupling joints (446), wherein each coupling joint (446) of the plurality of coupling joints (446) connects two directly successive rivets (44) to each other;
- moving a joining tool to a defined position on the substrate;
- separating a rivet forming an end of the chain of rivets from the chain of rivets;
- and
- connecting the separated rivet to the substrate by means of the joining tool.
Dependencies are inferred from the claim text.