US 2026/0242953 A1 · SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

Abstract

A technique improves productivity by shortening a heating time of a substrate. The a technique includes: a process chamber in which a substrate is heated; a container in which an unprocessed substrate to be loaded into the process chamber or a processed substrate unloaded from the process chamber is mounted; a supplier that supplies a fluid for heating the unprocessed substrate mounted in the container or cooling the processed substrate; a discharger that discharges the fluid from the container; an accumulator in which the fluid heated by cooling the processed substrate is accumulated; and a controller capable of performing control so as to supply the fluid accumulated in the accumulator to the container to heat the unprocessed substrate.

Claims20

Dependent claims

A substrate processing apparatus comprising:

a process chamber in which a substrate is heated;
a container in which an unprocessed substrate to be loaded into the process chamber or a processed substrate unloaded from the process chamber is mounted;
a supplier that supplies a fluid for heating the unprocessed substrate mounted in the container or cooling the processed substrate;
a discharger that discharges the fluid from the container;
an accumulator in which the fluid heated by cooling the processed substrate is accumulated;
and
a controller capable of performing control to supply the fluid accumulated in the accumulator to the container to heat the unprocessed substrate.

4 more elements

Dependencies are inferred from the claim text.

Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium

Life of this patent

Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium

Life of this patent

Abstract

Claims20