Low-thermal-expansion alloy
AssigneeShinhokoku Material Corp.
InventorsShingo MATSUMURA, Kotaro ONA
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Abstract
The present invention addresses the problem of providing a low-thermal-expansion alloy having a low coefficient of thermal expansion and excellent machinability. This low-thermal-expansion alloy is characterized by comprising, in mass %, up to 0.050% C, up to 0.50% Si, 2.00-4.00% Mn, 0.100-0.300% S, 35.00-40.00% Ni, and Fe and impurities as the remainder, [Mn] and [S] indicating the contents by mass % of Mn and S satisfying [Mn]/[S]≥10.0, and is characterized in that the alloy has an average coefficient of thermal expansion at 18-28° C. of 5.00×10−6°/C. or less.
Claims1
A low thermal expansion alloy, comprising, by mass %,
- C:
- 0.005% or less,
- Si:
- 0.50% or less,
- Mn:
- 2.00 to 4.00%,
- P:
- 0.050% or less,
- S:
- 0.100 to 0.300%,
- Ni:
- 35.00 to 40.00%, and
- balance of Fe and unavoidable impurities,
- wherein
- [Mn] and [S], which denote the content of Mn and S by mass %, satisfy
- [
- Mn
- ]
- /
- [
- S
- ]
- ≧
- 10.
- ,
- and
- an average coefficient of thermal expansion at 18 to 28° C. is 5.00×10−6/° C. or less.
Dependencies are inferred from the claim text.