Resin composition for film molding, film, and laminate

Abstract

A resin composition for film molding contains a poly(3-hydroxyalkanoate) resin (A) and a polylactic acid resin (B). The poly(3-hydroxyalkanoate) resin (A) contains a poly(3-hydroxyalkanoate) copolymer (A1), and a poly(3-hydroxybutyrate) (A2). The amount of the polylactic acid resin (B) is from 20 to 65 wt % based on the total amount of the poly(3-hydroxyalkanoate) resin (A) and the polylactic acid resin (B). The amount of a fatty acid amide (C) is from 0 to less than 0.5 parts by weight per 100 parts by weight of the poly(3-hydroxyalkanoate) resin (A). The total proportion of the poly(3-hydroxyalkanoate) resin (A) and the polylactic acid resin (B) in the total amount of the resin composition for film molding, excluding any inorganic filler, is 98.5 wt % or more.

Dependencies are inferred from the claim text.