Polyimide film, and preparation method and use thereof

Abstract

A polyimide film, and a preparation method and a use thereof, where the polyimide film has a thickness of greater than or equal to 250 μm, and includes a film layer A and at least one-layer film layer B in contact with each other; a surface roughness Rz of the film layer A is less than or equal to 1.0 μm; the number of micropores with a size greater than 0.1 mm in the film layer B is less than or equal to 1/m2; the film layer B has a density of greater than or equal to 1.45 g/cm3, and a surface roughness Rz of greater than or equal to 1.2 μm. The polyimide film provided in the present application has the characteristics of large thickness, small linear thermal expansion coefficient, high pressure resistance and low gas permeability.

Dependencies are inferred from the claim text.