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US 2026/0242554 A1Published application
Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHirosuke SAITO, Yiqun WANG, Hiroharu INOUE, Yasunori NISHIGUCHI
Life of this patent
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Abstract
A resin composition includes: a compound (A) represented by the following formula wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group; and a thermosetting resin (B) containing at least one selected from among a polyphenylene ether resin, a maleimide resin, and a hydrocarbon-based resin having an unsaturated double bond.
Claims9
A resin composition comprising:
- a compound (A) represented by the following formula:
- wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group, and
- a thermosetting resin (B) containing at least one selected from among a polyphenylene ether resin, a maleimide resin, and a hydrocarbon-based resin having an unsaturated double bond.
Dependencies are inferred from the claim text.