Method of laminating an interposer for die transfer substrates

A method of laminating a substrate, comprising:

• supplying a polymer film to a lamination module, wherein the polymer film comprises a bottom liner, a top liner, and one or more polymer layers;
• removing the bottom liner from the polymer film;
• supplying a substrate to a conveyor system of the lamination module;
• cutting the one or more polymer layers and the top liner with a cutting mechanism, wherein the cutting mechanism comprises a first blade and a second blade, wherein a space between the first blade and the second blade is less than about 10 cm;
• laminating the substrate with the polymer film;
• and
• removing the top liner from the polymer film.

A lamination system, comprising:

• a lamination module, comprising:
• a bottom liner recovery roller;
• a top liner recovery roller;
• a cutting mechanism configured to cut one or more polymer layers and the top liner, the cutting mechanism comprising a first blade and a second blade, wherein a space between the first blade and the second blade is less than about 10 cm;
• and
• a plurality of film rollers;
• a polymer film roll configured to supply a polymer film to the lamination module, wherein the polymer film includes one or more polymer layers, a top liner, and a bottom liner;
• a substrate source configured to supply a substrate;
• a substrate receiver;
• and
• a conveyor system.