Optical sensing module

A system, comprising:

• an optical sensing module comprising:
• a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising:
• a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength(s) of the other laser(s) of the plurality of lasers;
• an optical manipulation region, the optical manipulation region comprising an optical modulator, an optical multiplexer (MUX), or other optical manipulation elements;
• and
• one or more optical outputs for light originating from the plurality of lasers, wherein:
• the plurality of lasers is integrated onto the PIC via flip-chip die bonding or micro transfer printing;
• and
• the plurality of lasers includes one or more lasers having a III-V RSOA gain chip or coupon that is hybrid integrated to the PIC such that an optical mode in the III-V RSOA gain chip or coupon is edge-coupled to one or more waveguides of the PIC.

A system, comprising:

• an optical sensing module comprising:
• a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising:
• a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength(s) of the other laser(s) of the plurality of lasers;
• an optical manipulation region, the optical manipulation region comprising an optical modulator, an optical multiplexer (MUX), or other optical manipulation elements;
• and
• one or more optical outputs for light originating from the plurality of lasers;
• and one or more photodetectors,
• wherein the one or more photodetectors are located on the transmitter PIC such that the PIC is a transmitter/receiver photonic integrated circuit, and
• wherein the plurality of lasers includes one or more lasers having a III-V RSOA gain chip or coupon that is hybrid integrated to the PIC such that an optical mode in the III-V RSOA gain chip or coupon is edge-coupled to one or more waveguides of the PIC.

A system, comprising:

• an optical sensing module comprising:
• a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising:
• a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength(s) of the other laser(s) of the plurality of lasers;
• an optical manipulation region, the optical manipulation region comprising an optical modulator, an optical multiplexer (MUX), or other optical manipulation elements;
• one or more optical outputs for light originating from the plurality of lasers;
• and one or more photodetectors,
• wherein the one or more photodetectors are located separately from the transmitter photonic integrated circuit, and
• wherein the plurality of lasers includes one or more lasers having a III-V RSOA gain chip or coupon that is hybrid integrated to the PIC such that an optical mode in the III-V RSOA gain chip or coupon is edge-coupled to one or more waveguides of the PIC.