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US 2026/0239969 A1Published application
Dam application for exposed die with flat lid structure packages
AssigneeQUALCOMM Incorporated
InventorsJaekyu SONG, Tae Wan KIM, Rajneesh KUMAR
Life of this patent
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Abstract
Disclosed are semiconductor packages. In conventional semiconductor packages with exposed die application, a flat lid is applied on top of the exposed die in which thermal interface material (TIM) is used to increase heat dissipation. But when the lid is pressed, uneven squeeze out of the TIM material can result. By providing a dam to surround the TIM, uneven squeeze out is prevented.
Claims20
A semiconductor package, comprising:
- a die on a substrate with an underfill between the die and the substrate;
- a mold on the substrate and encapsulating side surfaces of the die and the underfill;
- a thermal interface material (TIM) on an upper surface of the die and on an upper surface of the mold;
- a lid on a center portion of the TIM, wherein the lid is above the die;
- and
- a dam on the mold, wherein the dam entirely surrounds the TIM.
3 more elements
A method of fabricating a semiconductor package, the method comprising:
- providing a die on a substrate with an underfill between the die and the substrate;
- forming a mold on the substrate and encapsulating side surfaces of the die and the underfill;
- forming a thermal interface material (TIM) on an upper surface of the die and on an upper surface of the mold;
- providing a lid on a center portion of the TIM, wherein the lid is above the die;
- and
- forming a dam on the mold, wherein the dam entirely surrounds the TIM.
3 more elements
Dependencies are inferred from the claim text.