Method for manufacturing electronic device, and cover glass

A method for manufacturing an electronic device in which a sensor element covered with a cover glass is mounted on a mounting substrate,

• the cover glass including
• a glass substrate, and
• an antireflection layer provided on a surface on at least one side of the glass substrate and having a micro concave-convex structure having an average cycle of concavities or convexities of less than or equal to a visible light wavelength,
• the method for manufacturing comprising:
• (1) a transfer step of transferring the micro concave-convex structure of a master to an uncured resin layer provided on the surface on the at least one side of the glass substrate and made of a light-curing resin yet to be cured;
• (2) a curing step of radiating light to the uncured resin layer to which the micro concave-convex structure has been transferred to cure the uncured resin layer and form the antireflection layer made of a cured product of the light-curing resin;
• (3) a baking step of heating the cover glass on which the antireflection layer has been formed;
• (4) an assembling step of installing the cover glass after the baking step at a position opposed to a light receiving surface of the sensor element to assemble a sensor module;
• and
• (5) a reflow step of placing the sensor module on the mounting substrate and applying heat at a temperature of more than or equal to 250° C. to solder the sensor module to the mounting substrate, wherein
• the light-curing resin yet to be cured contains a photopolymerizable component,
• the photopolymerizable component contains a resin (A) and a resin (B),
• the resin (A) is a monofunctional acrylate monomer having a phenyl group,
• the resin (B) is a bifunctional or higher functional acrylate monomer,
• the resin (A) has a content rate of more than 10% by mass and less than or equal to 40% by mass to a whole of the photopolymerizable component,
• the resin (B) has a content rate of more than or equal to 60% by mass and less than 90% by mass to the whole of the photopolymerizable component, and
• the cover glass on which the antireflection layer has been formed is heated at a temperature of more than or equal to 150° C. and less than 250° C. for more than or equal to 10 minutes in the baking step.

A cover glass that covers a sensor element mounted on a mounting substrate of an electronic device, the cover glass comprising:

• a glass substrate;
• and
• an antireflection layer provided on a surface on at least one side of the glass substrate, having a micro concave-convex structure having an average cycle of concavities or convexities of less than or equal to a visible light wavelength, and made of a cured product of a light-curing resin, wherein
• the cured product of the light-curing resin is a polymer of a resin (A) and a resin (B)
• the resin (A) is a monofunctional acrylate monomer having a phenyl group,
• the resin (B) is a bifunctional or higher functional acrylate monomer, and
• a remaining monomer derived from the resin (A) contained in the polymer has a content rate of less than or equal to 0.25% by mass.