Antenna in package structure and design method
AssigneeMetawave Corporation
InventorsKevin GU, Hadi Saeidi MANESH, Neda BATHAEI, Ricky Donald HECKLER, Raymond Anthony HAYNES, Andrew John BONTHRON
Life of this patent
Estimating the term…
Abstract
In accordance with various embodiments, a multi-layer electromagnetic antenna in package (AiP) device is provided. The device has a plurality of radiating elements configured in a symmetric pattern. Each of the radiating elements having a transmission line through the multi-layer device. Each of the transmission lines having a same electrical length to maintain a consistent phase of transmission signals. The device has a resonant cavity formed within the layers.
Claims20
A multi-layer electromagnetic device, comprising:
- an antenna layer having an array of radiating elements arranged symmetrically with respect to at least one axis of symmetry;
- and
- a set of transmission lines through layers of the device, each transmission line in the set of transmission lines having a same electrical length.
A method for constructing an AiP device, comprising:
- aligning a first set of radiating elements in a symmetric pattern;
- determining an electrical length of transmission lines for the radiating elements;
- and
- configuring paths for the transmission lines through a plurality of layers.
An antenna in package (AiP), comprising:
- a plurality of layers comprising:
- a core layer;
- a ground layer;
- a set of parasitic patches positioned on an antenna layer;
- a connection layer for connection to a controller;
- and
- a plurality of transmission lines through the plurality of layers, wherein each of the transmission lines has a same electrical length.
Dependencies are inferred from the claim text.