Scanning compensation method of electron beam inspection device, product and apparatus

Abstract

Provided are a scanning compensation method of an electron beam inspection device, a product and an apparatus. The method includes: performing continuous scanning detection by the electron beam inspection device according to a preset scanning direction of a detected surface of a wafer; in the scanning detection process, driving, by a stage bearing the wafer, the wafer to displace along a preset translation direction in a plane where the detected surface is located; detecting a jitter displacement of the stage in a displacement process by a position detection apparatus, wherein the jitter displacement is a deviation between an actual position and a theoretical position of the stage in the displacement process due to mechanical jitter; and compensating a scanning waveform of the electron beam inspection device according to the jitter displacement. The scanning error caused by mechanical jitter in the displacement process of the stage is reduced.

Dependencies are inferred from the claim text.