Probe structure and inspection apparatus
AssigneeKabushiki Kaisha Nihon Micronics
InventorsSatoshi NARITA, Takashi OGASAWARA
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Nihon Micronics
InventorsSatoshi NARITA, Takashi OGASAWARA
Estimating the term…
To make it possible to obtain matching of characteristic impedance at a connection terminal as a signal circuit relay point. The present disclosure provides a probe structure configured to transmit/receive a high-frequency signal to/from a device under test via a contact portion in electrical contact with an electrode of the device under test, the probe structure comprising: a main body part; a substrate holding member including a wiring substrate on one surface and fixed to the main body part on the other surface; a connector bonded to the wiring substrate of the substrate holding member and connecting wiring of the wiring substrate and a coaxial cable via a connection terminal; and an impedance adjustment unit configured to adjust a gap with the connection terminal to match an impedance.
A probe structure configured to transmit/receive a high-frequency signal to/from a device under test via a contact portion, the contact portion being in electrical contact with an electrode of the device under test, the probe structure comprising:
Dependencies are inferred from the claim text.