Temperature regulation device for semiconductor manufacturing device

A temperature regulation device for semiconductor manufacturing device, the temperature regulation device being for regulating a temperature of a thermal load in a semiconductor manufacturing device to a predetermined temperature, the temperature regulation device comprising:

• a refrigeration circuit including a refrigeration compressor that generates refrigerant having high temperature and high pressure, a delivery passage connected to the compressor and through which refrigerant is delivered from the compressor, a return passage connected to the compressor and through which refrigerant is returned to the compressor, a first circulation passage and a second circulation passage each having a connection port to be connected to the thermal load and each being for supplying refrigerant to the thermal load in a circulating manner, a switching circuit that mutually switches, between the first and second circulation passages, a circulation passage for delivering refrigerant to the thermal load and a circulation passage for receiving refrigerant from the thermal load by changing a communication state in which the first and second circulation passages are in communication with the delivery passage and the return passage, and a heat exchanger including a refrigerant heat exchange passage that connects the first circulation passage to the switching circuit;
• a heat-dissipating-water circuit including a heat-dissipating-water heat exchange passage through which heat-dissipating water that exchanges heat with refrigerant in the refrigerant heat exchange passage in the heat exchanger flows and a heat-dissipating-water supply/drainage passage through which heat-dissipating water is supplied to and drained from the heat-dissipating-water heat exchange passage;
• and
• a controller including a processor that controls the refrigeration circuit and the heat-dissipating-water circuit,
• wherein the first circulation passage includes an expansion valve that adiabatically expands refrigerant, and
• wherein the processor controls the switching circuit such that, when temperature regulation of the thermal load is performed by cooling, refrigerant is delivered to the thermal load from the connection port of the first circulation passage and refrigerant from the thermal load is received through the connection port of the second circulation passage and conversely, when temperature regulation of the thermal load is performed by heating, refrigerant is delivered to the thermal load from the connection port of the second circulation passage and refrigerant from the thermal load is received through the connection port of the first circulation passage.