Nanofabricated patterned mesoscopic circuits on diamond anvils

A process for fabricating a mesoscopic circuit on a diamond surface for use in diamond anvil cell (DAC) experiments, the process comprising:

• a. providing a diamond and a flat substrate;
• b. mounting the diamond pressed flat against the flat substrate to ensure a flat diamond surface for fabricating the mesoscopic circuit;
• c. spin-coating the flat diamond surface with a bi-electron beam resist layer comprising a bottom resist layer in direct contact with the flat diamond surface and a top resist layer over an exposed surface of the bottom resist layer;
• d. depositing a metal layer over the bi-electron beam resist layer;
• e. removing a selected portion of the metal layer and underlying bi-electron beam resist layer to expose a portion of the diamond surface in a pattern corresponding to one or more elements of the mesoscopic circuit using an E-lithography system;
• f. depositing at least one electrically conductive layer over the exposed portion of the diamond surface and a portion of the metal layer;
• and
• g. lifting off an unwanted portion of the at least one conductive layer and underlying metal layer and bi-electron beam resist layer to expose the mesoscopic circuit on the diamond surface.