Resin composition, method for manufacturing electronic apparatus, and electronic apparatus

A method for manufacturing an electronic apparatus, the method comprising:

• preparing a display module;
• providing a window on the display module;
• and
• providing an adhesive member on the display module or the window prior to the providing of the window,
• wherein the providing the adhesive member comprises:
• providing a resin composition having a shear viscosity of about 50 mPa·s or less as measured by a JISZ8803 method at about 30° C. on the display module or the window;
• and
• irradiating the provided resin composition with light in air to form the adhesive member,
• wherein the resin composition comprises at least one monofunctional (meth)acrylate compound, at least one photopolymerization initiator, and a dendritic (meth)acrylate copolymer having at least one (meth)acrylate group at at least one terminal, and
• wherein the light comprises UVA and UVV and has an accumulated illuminance of about 900 mW and an accumulated light quantity of about 1800 mJ/cm2.

An electronic apparatus comprising:

• a display module;
• a window disposed on the display module;
• and
• an adhesive member disposed between the display module and the window,
• wherein the adhesive member comprises a polymer obtained from a resin composition comprising at least one monofunctional (meth)acrylate compound, at least one photopolymerization initiator, and a dendritic (meth)acrylate copolymer having at least one (meth)acrylate group at at least one terminal, and
• wherein the resin composition has a shear viscosity of about 50 mPa·s or less as measured by a JISZ8803 method at about 30° C.