Polyimide film having high dimensional stability and method for preparing same

Abstract

Provided are a polyimide film having excellent dimensional stability and having an expansion coefficient ratio, represented by equation 1 below, of greater than 0 and less than or equal to 2.5, and a method for preparing same. The polyamide film is prepared by means of an imidization reaction of a polyamic acid solution containing two or more types of acid dianhydride components and two or more types of diamine components, thereby satisfying the expansion coefficient ratio. <Equation 1> Expansion coefficient ratio=hygroscopic expansion coefficient (ppm/RH %)/thermal expansion coefficient (ppm/° C.)

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