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US 2026/0234333 A1Published application
Polyamide-imide, resin composition, molded article, and film
AssigneeKaneka Corporation
InventorsFumiyasu Ishiguro, Keisuke Katayama, Yuki Kawashima
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Abstract
A polyamide-imide and a resin composition contain a polyamide-imide and an acryl-based resin. The polyamide-imide contains a diamine component, a tetracarboxylic dianhydride component and a polycarboxylic acid component. The diamine component includes a diamine having one or more structures selected from CF3—O—, —(CF2—O)n—, and —O—(CF2—CF2—O)n—, where n is an integer of 1-20. The diamine may be 2,2′-bis(trifluoromethoxy)benzidine, 3,3′-bis(trifluoromethoxy)benzidine, 2,3′-bis(trifluoromethoxy)benzidine, or the like.
Claims15
A polyamide-imide comprising:
- a diamine component;
- a tetracarboxylic dianhydride component;
- and
- a polycarboxylic acid component,
- wherein the diamine component comprises a fluorine atom-containing diamine having one or more structures selected from CF3—O—, —(CF2—O)n—, and —O—(CF2—CF2—O)n—, where n is an integer of 1 to 20.
2 more elements
Dependencies are inferred from the claim text.