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US 2026/0233989 A1Published application
Methods of Temperature Sensing in a MEMS Resonator Using Structural Resistance
AssigneeStathera IP Holdings Inc.
InventorsRiccardo Gatti, Siddharth Kumanduri
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Abstract
MEMS devices with co-packaged thermistors are described where a serial path for the thermistor is created through a plurality of thermistor plugs in a cap layer and a plurality of thermistor linkages in a device layer laterally adjacent to a resonator element. In this manner the thermistor resistance can be attributed to resistance of the thermistor plugs and their bonding interfaces, while the more highly doped thermistor linkages in the device layer provide serial connection between the thermistor plugs.
Claims18
A MEMS device with co-packaged thermistor comprising:
- a support layer including a lower cavity;
- a device layer bonded to the support layer, the device layer including a resonator element directly over the lower cavity and a plurality of laterally separate thermistor linkages;
- a cap layer bonded to the device layer, the cap layer including a plurality of thermistor plugs bonded to the plurality of laterally separate thermistor linkages;
- and
- a first contact terminal in electrical connection with a first thermistor plug of the plurality of thermistor plugs, and a second contact terminal in electrical connection with a second thermistor plug of the plurality of thermistor plugs;
- wherein a serial path exists from the first contact terminal, through the plurality of thermistor plugs and the plurality of laterally separate thermistor linkages to the second contact terminal.
3 more elements
Dependencies are inferred from the claim text.