Package material and method of producing a package material
AssigneeSony Group Corporation
InventorsYUUKO TABEI, SEIJI YAMADA, YASUTOSHI KAWATE, NAOTO MORINAGA, TAKAYUKI YAGI, SATOSHI AWATSUJI, MITSUHIRO OKAMOTO, JUNKO KATSURAKU, KAZUHIKO AIKO, YASUNORI KONISHI, TOMONORI WATANABE, JUN NISHIMURA
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