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US 2026/0233537 A1Published application
Method for fabricating heating device
AssigneeInnolux Corporation
InventorsYu-Tsung LIU, Cheng-Hsueh HSIEH, Wei-Lin WAN, Te-Yu LEE
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Abstract
A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.
Claims9
A method for fabricating a heating device, comprising:
- providing a substrate;
- forming a semiconductor layer on the substrate;
- forming a gate on the semiconductor layer;
- forming a source and a drain on the gate;
- forming a heater on the substrate;
- and
- forming a bridging component on the substrate, wherein the bridging component is electrically connected to the heater and either the source or the drain.
4 more elements
Dependencies are inferred from the claim text.