Structures including embedded devices and associated devices and methods for forming such structures

Abstract

A method of forming a structure includes positioning a sensor within a mold. The method further includes depositing particles of a material having a high-temperature melting point in the mold and around the sensor. The method also includes applying pressure to the material having the high-temperature melting point in the mold while heating the material having the high-temperature melting point in the mold to a sintering temperature of the particles of the material having the high-temperature melting point in the mold. The method further includes forming a fully dense solid structure from the particles of the material having the high-temperature melting point in the mold with the sensor disposed in the fully dense solid structure.

Dependencies are inferred from the claim text.