Semiconductor package with top-side base plate

A semiconductor package, comprising:

• a housing forming an outer shape sealed with an encapsulant;
• a base plate fixed to a top surface of the housing so as to be exposed, the base plate including:
• a first lead portion;
• and
• a second lead portion, the first lead portion and the second lead portion to be electrically connected to a printed circuit board;
• and
• a plurality of pins extending in a first lateral direction of the housing so as to be exposed, and to be electrically connected to the printed circuit board,
• wherein a bottom surface of the housing is to face the printed circuit board to electrically connect the semiconductor package to the printed circuit board,
• wherein the base plate comprises:
• a base area located on the top surface of the housing;
• and
• an extended area located outside the housing by extending from the base area in a second lateral direction which is a direction opposite to the first lateral direction, the extended area including the first lead portion and the second lead portion,
• wherein the base area is exposed upward from the housing and the base plate is fixed to the housing such that an edge area of the base area is continuously covered with the encapsulant, and
• wherein, the base area further includes a contact zone which is a partial area of the housing that exists between the base area and the extended area to separate the base area and the extended area.