Semiconductor structure and method of forming thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYan-Ting LIN, Chien-I KUO, Ming-Hua YU, Chii-Horng LI
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYan-Ting LIN, Chien-I KUO, Ming-Hua YU, Chii-Horng LI
Estimating the term…
A method of forming a semiconductor structure includes a number of operations. A plurality of channel regions is formed over a substrate. First semiconductor material layers are formed on opposite sides of the channel regions, wherein growth rates of the first semiconductor material layers along a <110> direction and a <100> direction are controlled so that from a top view, an angle from a sidewall of one of the first semiconductor material layer to an interface of the one of the first semiconductor material layer and the corresponding channel region is in a range from about 54 degrees to about 90 degrees. Second semiconductor material layers are formed over the first semiconductor material layers, wherein the first and second semiconductor material layers form source/drain regions on the opposite sides of the channel regions. A gate structure is formed and wraps around the channel regions.
A method, comprising:
A method, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.