Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising:

• providing a substrate;
• forming a conductive layer on the substrate;
• forming an insulating layer on the conductive layer;
• disposing a first electronic element on the conductive layer and electrically connecting the first electronic element to the conductive layer;
• disposing a second electronic element on the conductive layer and electrically connecting the second electronic element to the conductive layer,
• wherein the first electronic element and the second electronic element have different functions;
• forming a light-shielding layer on the insulating layer;
• patterning the light-shielding layer to form a first opening and a second opening,
• wherein in a top view direction of the electronic device, the first opening is overlapped with the first electronic element and the second opening is overlapped with the second electronic element;
• and
• forming a first light converting element in the first opening and a second light converting element in the second opening,
• wherein the first light converting element converts light to a first color, and the second light converting element converts light to a second color, and the first color is different from the second color.