Edge-triggered transceiver in semiconductor package and calibration method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorWEI SHUO LIN
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorWEI SHUO LIN
Estimating the term…
A semiconductor package is provided. The semiconductor package includes an interposer, a first die and a second die over the interposer, and an edge-triggered transceiver. The edge-triggered transceiver includes a transfer lane disposed in the interposer, a capacitor, a transmitter, and a receiver. The receiver includes an inverter having an input terminal coupled to a second end of the transfer lane and an output terminal, a first resistor coupled to the input terminal of the first inverter, a second resistor coupled between the input terminal and the output terminal of the first inverter, a first switch coupled between the first resistor and a node of a first reference voltage, and a second switch coupled between the first resistor and a node of a second reference voltage. The inverter receives the second signal and provides a third signal to turn on one of the first and second switches.
A semiconductor package, comprising:
An edge-triggered transceiver, comprising:
A calibration method for an edge-triggered transceiver in a semiconductor package, wherein the edge-triggered transceiver comprises a transfer lane disposed in an interposer of the semiconductor package, the calibration method comprising:
Dependencies are inferred from the claim text.