# US 2026/0229853 A1 · Sub-module

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- Number: US 2026/0229853 A1
- Document ID: US20260229853A1
- Status: Published application
- Kind: A1
- Application number: 19/158,334
- Filed: 2024-02-07
- Published: 2026-08-06
- Earliest claimed: 2023-03-08
- Assignees: Ls Electric Co., Ltd.
- Applicants: Ls Electric Co., Ltd.
- Inventors: Jin Hee LEE; Dae Chul KANG
- Web page: https://patentgrep.com/patent/US20260229853A1

## CPC

- H02B 1/28: dustproof, splashproof, drip-proof, waterproof or flameproof
- H02B 1/20: Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards (installations of bus-bars H02G5/00)
- H02B 1/30: Cabinet-type casings; Parts thereof or accessories therefor
- H02M 1/327: {against abnormal temperatures}
- H02M 7/00: Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H02M 7/48: using discharge tubes with control electrode or semiconductor devices with control electrode
- H05K 7/14: Mounting supporting structure in casing or on frame or rack
- H05K 7/20: Modifications to facilitate cooling, ventilating, or heating
- H02B: BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A sub-module is disclosed. The sub-module, according to one aspect of the present disclosure, comprises: an IGBT which is connected to an external power source or load in an electrically conductive manner and of which a surface in one direction has a greater surface area than a surface in another direction; a heat-dissipating member coupled to one surface of the IGBT in the one direction, so as to cool the heat generated by the IGBT; and a capacitor member which is connected to the IGBT in an electrically conductive manner and is arranged to face the other surface of the IGBT in the one direction, wherein the heat-dissipating member comprises a heat-dissipating body coupled to the one surface of the IGBT in the one direction.

## Claims

### Claim 1

A sub-module, comprising:
an insulated gate bipolar transistor (IGBT) that is electrically connectable to an external power source or load and has a surface area in one direction greater than that of a surface in another direction;
a heat-dissipating member coupled to one surface of the IGBT in the one direction to cool heat generated from the IGBT; and
a capacitor member that is electrically connected to the IGBT and is disposed to face the other surface of the IGBT in the one direction,
wherein the heat-dissipating member comprises:
a heat-dissipating body coupled to the one surface of the IGBT in the one direction;
a heat-dissipating support part that continuously extends between the heat-dissipating body and the capacitor member and is coupled to each of the heat-dissipating body and the capacitor member; and
an IGBT-accommodating part that is defined by being partially surrounded by the heat-dissipating body and the capacitor member, and accommodates the IGBT.

### Claim 2 (depends on 1)

The sub-module of claim 1, wherein the heat-dissipating body has a surface, which faces the IGBT, the surface area of which is greater than that of the one surface of the IGBT in the one direction.

### Claim 3 (depends on 2)

The sub-module of claim 2,
wherein a plurality of IGBTs are provided, the plurality of IGBTs being spaced apart from one another in a width direction and a length direction of the heat-dissipating body,
and the heat-dissipating body is formed to cover all of the plurality of IGBTs along the one direction.

### Claim 4 (depends on 1)

The sub-module of claim 1,
further comprising:
a busbar member that is accommodated in the IGBT-accommodating part and electrically connected to each of the IGBT and the capacitor member,
wherein the capacitor member comprises:
a capacitor body that is coupled to the heat-dissipating support part and surrounds the IGBT-accommodating part from one side; and
a capacitor terminal that is coupled to the capacitor body and electrically coupled to the busbar member.

### Claim 5 (depends on 4)

The sub-module of claim 4,
wherein the busbar member comprises:
an input busbar that is electrically coupled to each of the IGBT and an external power source or load; and
an output busbar that is electrically coupled to each of the IGBT and the capacitor terminal.

### Claim 6 (depends on 5)

The sub-module of claim 5,
wherein a plurality of IGBTs are provided, the plurality of IGBTs being spaced apart from one another in a width direction and a length direction of the heat-dissipating body,
and the input busbar comprises:
a first input busbar that is electrically coupled to some of the plurality of IGBTs and to an external power source or load, respectively; and
a second input busbar that is spaced apart from the first input busbar and is electrically coupled to the other some of the plurality of IGBTs and to an external power source or load, respectively.

### Claim 7 (depends on 6)

The sub-module of claim 6,
wherein the second input busbar is disposed closer to the capacitor member along the one direction than the first input busbar,
and the busbar member comprises:
a support member that is positioned between the other surface of the IGBT and the second input busbar and is electrically coupled to each of the IGBT and the second input busbar.

### Claim 8 (depends on 5)

The sub-module of claim 5,
wherein a plurality of IGBTs are provided, the plurality of IGBTs being spaced apart from one another in a width direction and a length direction of the heat-dissipating body,
a plurality of capacitor terminals are provided, the plurality of capacitor terminals being spaced apart from one another in the width direction of the heat-dissipating body,
and the output busbar comprises:
a first output busbar that is electrically coupled to some of the plurality of IGBTs and to one of the plurality of capacitor terminals, respectively; and
a second output busbar that is electrically coupled to the other some of the plurality of IGBTs and to another one of the plurality of capacitor terminals, respectively.

### Claim 9 (depends on 8)

The sub-module of claim 8,
wherein the output busbar comprises:
a first extension portion that extends in a length direction of the heat-dissipating body and is electrically coupled to a plurality of the IGBTs that are spaced apart from one another in the length direction of the heat-dissipating body; and
a second extension portion that is continuous with the first extension portion and extends in the length direction and a height direction of the heat-dissipating body and is electrically coupled to the capacitor terminal.

### Claim 10 (depends on 4)

The sub-module of claim 4, wherein a surface area of one surface of the capacitor body that faces the IGBT is greater than a surface area of one surface of the IGBT that faces the capacitor body.

### Claim 11 (depends on 4)

The sub-module of claim 4, wherein the capacitor member, the busbar member, the IGBT, and the heat-dissipating member are sequentially stacked along a height direction.

### Claim 12 (depends on 1)

The sub-module of claim 1,
further comprising:
a housing member that is disposed to face the IGBT with the heat-dissipating member interposed therebetween and is coupled to and supported by the heat-dissipating member;
a board member that is accommodated in a housing space formed inside the housing member and is electrically connectable to the outside; and
a cover member that covers the board member and is coupled to the housing member.

### Claim 13 (depends on 12)

The sub-module of claim 12,
wherein the housing member comprises:
a housing surface that surrounds the housing space in an outer circumferential direction; and
a housing opening that is formed through the housing surface to allow communication between the housing space and the outside,
and the board member comprises:
an input module that is electrically connectable to the outside;
a board body coupled to the input module and supporting the input module;
a partition member extending along an outer circumference of the board body; and
a board communication hole formed through the partition member to communicate with the housing opening.

### Claim 14 (depends on 12)

The sub-module of claim 12,
wherein the cover member comprises:
a cover body that covers the board member; and
a cover communication hole formed through the cover body to allow communication between the housing space and the outside.